SIMCO ECM-H Series (High-End Industrial Grade) - Technical Overview
Series Positioning
Top-tier electrostatic chuck (ESC) monitoring & control for advanced semiconductor manufacturing, including:
Logic/DRAM/3D NAND at ≤7nm nodes
High-power processes (etch, CVD, ALD)
Compound semiconductor (SiC/GaN) production
Key Technological Advantages
1. Ultra-High Precision Control
Voltage stability: ±0.05% of setpoint (0-5kV DC/AC)
Current resolution: 10nA (leakage current detection)
Temperature uniformity: ±0.3°C across 300mm wafer
2. Multi-Channel Architecture
Positioning: High-precision electrostatic chuck monitoring and control system for advanced semiconductor manufacturing (such as logic/memory chips, compound semiconductors), supporting harsh process environments (plasma, high temperature, etc.).
1. Standard models (single/dual/quad channels)
Model Number of channels Temperature control Voltage range Key functions Typical application scenarios
ECM-H1 1 Single zone 0-5kV DC Basic high-precision monitoring, SECS/GEM communication Packaging equipment, small etcher
ECM-H2 2 Dual independent zones 0-5kV DC Dual-channel synchronous control, support AC/DC mode Thin film deposition (PVD/CVD)
ECM-H4 4 Four independent zones 0-5kV DC Multi-zone temperature uniformity control, EtherCAT real-time communication 300mm wafer etching/lithography machine
2. High-voltage/high-frequency extended models
Model Special functions Voltage/frequency range Applicable scenarios
ECM-H2-HV Support 10kV high voltage (SiC/GaN process) 0-10kV DC Wide bandgap semiconductor manufacturing
ECM-H4-RF Integrated RF impedance matching (13.56MHz plasma) 0-5kV DC + RF synchronization advanced etching/stripping equipment
3. Customized models (OEM/special needs)