SIMCO ECM-Pro Series Professional Electrostatic Chuck Monitor Control System

SIMCO ECM-Pro series is a multi-channel electrostatic chuck (ESC) monitoring and control system for high-end semiconductor manufacturing and precision equipment. It is designed for complex applications that require high-precision, multi-zone independent control, such as:

Advanced logic/memory chip manufacturing (3nm/5nm process)

Multi-zone heated electrostatic chuck system

Large panel display (OLED/MicroLED) equipment

High-precision wafer-level packaging

Core functions and technical features

1. Multi-channel independent monitoring and control

Supports 4/8/16 channels of synchronous monitoring (such as ECM-Pro4/Pro8/Pro16)

Each channel can be independently configured:

Electrostatic adsorption voltage (0~5kV DC/AC)

Temperature control (RTD/Pt100 sensor, ±0.1°C accuracy)

Leakage current detection (pA resolution)

2. High-precision temperature control system

Multi-zone temperature adjustment: Supports up to 16 independent temperature zones to solve the wafer edge effect (Edge Effect)

Adaptive PID algorithm: fast response to thermal load changes (such as plasma process)

Temperature uniformity: temperature difference across the entire wafer surface <±1°C (@200mm wafer)

3. Advanced diagnostic functions

Real-time insulation monitoring: detect aging or contamination of AlN/SiC dielectric layers

Arc Detection: nanosecond response to prevent high-voltage breakdown

Predictive maintenance: evaluate suction cup life based on AI algorithm

4. Industrial-grade communication and integration

Standard interfaces:

EtherCAT (real-time control)

SECS/GEM (semiconductor equipment communication)

OPC UA (Industry 4.0 data integration)

Compatible with mainstream equipment manufacturers: Applied Materials, Lam Research, TEL, etc.

5. Data visualization and analysis

Built-in web interface: real-time display of adsorption force/temperature distribution heat map

Data logging: supports SQL database storage to meet FDA 21 CFR Part 11 compliance

SPC analysis: automatic generation of Cp/Cpk reports

SIMCO ECM-Pro series model overview

1. Basic multi-channel models

Model Number of channels Temperature control zones Voltage range Communication interface Core application scenarios

ECM-Pro4 4 4-zone independent 0-5kV DC EtherCAT, SECS/GEM Etcher, thin film deposition equipment

ECM-Pro8 8 8-zone independent 0-5kV DC EtherCAT, OPC UA Large size wafer (300mm)

ECM-Pro16 16 16-zone independent 0-3kV DC EtherCAT, SECS/GEM G10.5 panel/OLED mass transfer

2. High voltage extension models

Model Special functions Voltage range Applicable scenarios

ECM-Pro4-HV Supports 10kV high voltage (such as SiC wafer processing) 0-10kV DC Wide bandgap semiconductor manufacturing

ECM-Pro8-RF Integrated RF matching network (for plasma process) 0-5kV DC Etching/stripping equipment

3. Customized models

Model Customized functions Notes

ECM-Pro4-TM dual mode (DC+AC electrostatic adsorption) requires 6 weeks of advance ordering

ECM-Pro16-LN2 liquid nitrogen cooling interface (for low temperature process) supports -196°C~200°C temperature control

ECM-Pro32 (OEM only) 32-channel cluster control only available for cooperation with equipment manufacturers